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SEMICONDUCTOR


Micron Technologies, (formerly Dominion Semiconductor & IBM/Toshiba)
Manassas, VA - ADP Marshall, Whiting Turner Contracting Company, Washington Group International and Micron

  • On-going for 10 years
  • 280,000 sq. ft. of clean space for semiconductor wafer manufacturing, ultimately leading to 300 mm production
  • 140,000 sq. ft. of fandeck/mechanical/interstitial
  • Deionized water systems
  • Ultra high purity chemical distribution systems
  • Ultra high purity gas systems
  • Process exhaust system
  • Tool hook-up program
  • Bulk nitrogen and argon systems



IBM B/323A 300mm Annex Phase II

Fishkill, NY

  • Whiting-Turner Construction Manager
  • 100K sq ft Semiconductor Manufacturing facility
  • Installation of High Purity Process piping
  • HP gasses, Utility gasses, Ultra Pure Water, DI water, Process Waste and Process mechanical systems.


WhiteOak Semiconductor - Fab 1 & Probe, Assembly and Test
Sandston, VA - DPR Construction and WhiteOak

200,000 sq. ft. DPR Construction base build and tool hook-up

  • This $1 billion plus fab was completed on schedule within 12 months
  • 850,000 sq. ft. facility for semiconductor wafer processing.  This included 76,500 sq. ft. of clean room production area.
  • Deionized water systems
  • Process mechanical systems
  • Ultra high purity gases
  • Ultra high purity chemical distribution systems
  • Process exhaust systems
  • Chemical and acid waste
  • Slurry system
  • Tool hook-up program


Infineon Technologies - Fab II, Cub II & PATX
Austin Commercial and Infineon Direct

  • This semiconductor manufacturing facility consisted of 650,000 sq. ft., which included 100,000 sq. ft. of class 100 clean room area
  • Process exhaust systems
  • Tool Hook-up program
  • Ultra high purity gases
  • Ultra high purity chemicals
  • Specialty gases including pyrophorics
  • Process waste systems
  • Deionized water system


IBM Corporation 323 Bldg. Modifications
East Fishkill, NY - Whiting Turner Contracting Company

  • Site wide mechanical infrastructure upgrades to support new 300 mm manufacturing facility.  One hundred thirty seven tie-ins to existing mechanical systems were required over a five day period, requiring extreme safety precautions and careful coordination.
  • Ultra high purity gases and chemicals
  • Specialty gases including pyrophorics
  • Process waste (acid and slurry)
  • Fuel oil distribution system
  • Deionized water
  • Chilled and low temperature chilled water
  • Terteriary water
  • High purity hydrogen distribution system (double contained)
  • Sanitary & domestic water systems
  • HVAC hydronic systems
  • Jacket cooling water
  • Secondary hot water
  • High pressure steam


Texas Instruments RFAB
Richardson, TX

  • 1,000,000 sq.ft., 300mm Semiconductor Fabrication Facility
  • 220,000 sf Cleanroom
  • Mechanical Systems Installed:
  • DI Water Distribution
  • Acid, Solvent and General Exhaust Systems
  • Process Cooling Water Distribution
  • Specialty Gas Rooms & Piping Distribution
  • Subfab Interstitial Steel System



Intel FAB 22
Chandler, AZ
  • Customer: Hoffman General Contracting, Inc.
  • Owner:   Intel Corporation
  • Scope of work: HVAC Wet and Dry
  • Schedule: 12 months

 


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